发明名称 Bonding of porous materials to other materials utilizing chemical vapor deposition
摘要 A process for bonding a porous material having an opened porous cellular structure to a substrate material, the process including the steps of: conditioning the substrate with tantalum in a reactor at 925 DEG C. having a tantalum source pot at 550 DEG C.; affixing the porous material to the conditioned substrate to form an affixed composite structure by clamping the porous material to the conditioned substrate; and, subjecting the composite structure to a chemical vapor deposition process (CVD) which uses tantalum as a source material for a time sufficient to CVD bond the porous material to the conditioned substrate material.
申请公布号 US6063442(A) 申请公布日期 2000.05.16
申请号 US19980179119 申请日期 1998.10.26
申请人 IMPLEX CORPORATION 发明人 COHEN, ROBERT C.;VARGAS, JOSEPH R.
分类号 C23C16/04;C23C16/14;C23C16/44;(IPC1-7):C23C16/08 主分类号 C23C16/04
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