发明名称 |
Bonding of porous materials to other materials utilizing chemical vapor deposition |
摘要 |
A process for bonding a porous material having an opened porous cellular structure to a substrate material, the process including the steps of: conditioning the substrate with tantalum in a reactor at 925 DEG C. having a tantalum source pot at 550 DEG C.; affixing the porous material to the conditioned substrate to form an affixed composite structure by clamping the porous material to the conditioned substrate; and, subjecting the composite structure to a chemical vapor deposition process (CVD) which uses tantalum as a source material for a time sufficient to CVD bond the porous material to the conditioned substrate material.
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申请公布号 |
US6063442(A) |
申请公布日期 |
2000.05.16 |
申请号 |
US19980179119 |
申请日期 |
1998.10.26 |
申请人 |
IMPLEX CORPORATION |
发明人 |
COHEN, ROBERT C.;VARGAS, JOSEPH R. |
分类号 |
C23C16/04;C23C16/14;C23C16/44;(IPC1-7):C23C16/08 |
主分类号 |
C23C16/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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