| 摘要 |
PROBLEM TO BE SOLVED: To enable miniaturization of a module or a set including a light- emitting element and a light-receiving element by making external forms of the elements as thin as possible. SOLUTION: Semiconductor chips 21, 22 are a light-emitting element and a light-receiving element. A resin sealing body 24 sealing the elements is composed of optically transparent material. On a region where a light is outputted from the element and a region where a light enters the element, a recessed part 25 is formed, on which a reflecting surface 26 is constituted. As a result, exiting and incidence of a light are made possible via a side surface E. A wide sensitivity region can be obtained due to the form of the side surface. |
