发明名称 PARTS JOINTED BY BRAZING, SUBSTRATE TO WHICH PARTS ARE JOINTED BY BRAZING, MOUNTED SUBSTRATE AND MOUNTING METHOD FOR PARTS
摘要 PROBLEM TO BE SOLVED: To supply the sufficient amount of solder, to improve jointing strength and to easily and precisely position a mounted part by installing projecting or recessed parts fitted to the recessed or projecting parts of a substrate to be jointed. SOLUTION: When a part terminal 3 on a mounted part 2 is arranged on a mounted board 1 through solder paste 7 applied on a land pattern on the mounted board 1, projecting and recessed parts 4 on the part terminal 3 and projecting/recessed parts 5 on the land pattern 6 corresponding to the parts are combined and are temporarily fixed at the time of positioning by a parts mounting machine. When the part terminal 3 is physically and electrically fixed on the land pattern in a reflow process, the amount of solder paste applied to the terminal where the projecting/recessed parts are made is increased by the increased amount of an effective soldering area. Thus, soldering junction strength improves and soldering reliability improves.
申请公布号 JP2000133919(A) 申请公布日期 2000.05.12
申请号 JP19980301346 申请日期 1998.10.22
申请人 SONY CORP 发明人 KODAIRA SHINICHI
分类号 B23K1/00;B23K33/00;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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