| 摘要 |
<p>An adhesive composition suitable for printed circuit boards, particularly flexible ones, comprising (1) a specific phosphate ester represented by general formula (I), (2) an aromatic compound bearing a phenolic hydroxyl group and having a softening point of 60 to 200 °C, (3) an epoxy resin, and (4) a carboxylated nitrile/butadiene rubber in such proportions by weight as to satisfy the relationship: 0 < component (2)/(component (3) + component (4)) < 1; and flexible printed circuit boards made by using the composition.</p> |
