| 摘要 |
PROBLEM TO BE SOLVED: To improve plate removability of a filling cream solder at the time of snap-off operation by providing a shaft for vibrating an electronic circuit board in a positioning unit, and conducting a snapping-off operation in connection with vibration of the positioning unit in a plane direction. SOLUTION: A cream solder is filled in a screen mask opening by a squeegee, a positioning shaft 9 is operated, and a vibration of a positioning unit is started in a planar direction of a stage. Thereafter, a descending operation of a vertical stage shaft 7 is started, a cream solder filled from the screen mask opening is removed. When a descending distance arrives at a preset value, an exciting shaft 8 is raised at a predetermined amount at a set speed, and then an X-Y table is fallen to an origin position, and a vibrating direction of the table is snapped off by using both the X-Y plane direction and a Z-axis direction. Thus, plate removability of the filled cream solder at the time of the snap-off can be improved, and soldering fault can be prevented.
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