发明名称 Circuit board via connections
摘要 A "Gatling gun" via to interconnect circuit from a first side of a substrate or printed circuit board, to a second side of the substrate or board. The present via structure comprises a center conductor via 130 surrounded by a plurality of ground vias (eg 132, 134). The plurality of ground vias shield the center conductor via, thus providing electrical isolation for the conductor via from the rest of the circuitry. In one embodiment, the conductor via is electrically connected to a conductive pattern on the substrate by a wire bond.
申请公布号 GB2343298(A) 申请公布日期 2000.05.03
申请号 GB19990025204 申请日期 1999.10.25
申请人 * HEWLETT-PACKARD COMPANY 发明人 LEWIS R * DOVE;JOHN F * CASEY;RONALD J * BARNETT
分类号 H05K1/11;H01L23/66;H05K1/02;H05K3/42 主分类号 H05K1/11
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