| 摘要 |
PROBLEM TO BE SOLVED: To provide a stack package whose total thickness is not increased and in which a signal transfer route is short and to provide its manufacturing method. SOLUTION: This stack package contains a ceramic capsule 50 in which a pair of protrusion parts are formed on the surface on both sides. Moreover, it contains a first semiconductor chip 30 which is bonded, by using an adhesive, onto the surface between the protrusion parts of the ceramic capsule 50 in such a way that a bonding pad 31 and a bonding pad 41 are directed upward. In addition, it contains a second semiconductor chip 40 which has a size to such an extent that the bonding pads 31, 41 are exposed on both sides of the ceramic capsule 50 and which is bonded, by using an adhesive, onto the rear surface of the ceramic capsule 50 in such a way that the bonding pads 31, 41 are directed upward. Furthermore, it contains metal wires both ends of which are connected to the bonding pads 31, 41 of the first and second semiconductor chips 30, 40 and the intermediate parts of which are placed on the protrusion parts of the ceramic capsule 50. In addition, it contains a sealing agent which molds the whole in such a way that the intermediate parts of the metal wires placed on the protrusion parts of the ceramic capsule 50 are exposed. In addition, it contains conductive bumps 140 which are formed in the intermediate parts of the metal wires exposed from the sealing agent. In addition, it contains solder balls which are mounted on the conductive bumps 140. |
