| 摘要 |
PROBLEM TO BE SOLVED: To provide transfer facility to an object to be processed in a semiconductor manufacturing line, which omits mechanical parts as much as possible. SOLUTION: This facility to an object to be processed transfer includes water passages 2, 3, 4, 5, 6, 7, 8 and 22 provided along a predetermined transfer line, means 9 and 12 for producing water flow in these passages, and a wafer accommodating container 1 for enabling accommodating therein a wafer to be transferred by the water flows of the water passages as an object to be processed. With such an arrangement, the wafer is transferred by the water flow along the water passages to a desired location, in a condition in which the wafer is accommodated in the wafer accommodation container. |
