发明名称 POWER CUTOFF FOR METAL FILM DEPOSITION EQUIPMENT
摘要 PURPOSE: A power cutoff for metal film deposition equipment is provided which could prevent the execution of sputtering with hardware when loading error of wafer is occurred or process time and power exceed. CONSTITUTION: In executing sputtering by permitting direct-current voltage to target(6)placed in the opposite side of wafer(4) loaded inside of vacuum chamber(2), the power cutoff comprises of regular-shutting switch(14) having push button in the middle of line(12), which connects the target(6) and direct-current power supply(10).
申请公布号 KR20000021234(A) 申请公布日期 2000.04.25
申请号 KR19980040238 申请日期 1998.09.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JIN GUK
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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