| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electroconductive paste capable of reducing the occurrence of reflow crack as a dye bonding material for a semiconductor apparatus having excellent reliability by mixing a composition containing a specific cyclic Schiff base compound with an electroconductive material. SOLUTION: This heat-resistant curable resin composition comprises a cyclic Schiff base compound of formula I or formula II (R1, R2 and R3 are each H, a lower alkyl, a lower alkoxide, a halogen, a lower fluoroalkyl or an alkylene) obtained by reacting a diamine-based compound such as metaphenylenediamine with a dialdehyde-based compound such as metaphenylene dialdehyde. An electroconductive paste is obtained by mixing the cyclic Schiff base compound with 30-99 wt.% of an electroconductive material composed of metal powder.
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