| 摘要 |
PROBLEM TO BE SOLVED: To reduce the warping of a workpiece to be cut or the waviness of a cut surface, and improve the surface roughness of the cut surface of the workpiece. SOLUTION: In a reciprocatively traveling wire saw for cutting an ingot 32 into many thin platelike wafers by winding a traveling wire 14 on a groove roller having plural grooves to form a wire row, and thereto pressing the ingot 32 that is a workpiece while supplying working liquid to the wire row; since the ingot 32 is made to be cut by a setting wire tensile force in a portion for contributing cutting 40 (N) or more, and 1800 (N/mm2) or more in tension, or a breaking load of the wire 14 of 50% or more; the vibration of the wire 14 forming the wire row can be reduced. Consequently a wire row interval Cw can be stabilized to finish the warping of the wafer that is a cut surface of the surface waviness or roughness into a proper condition. |
