CURABLE TYPE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain colloidal particles containing epoxy groups introduced thereinto and a curable type composition using the colloidal particles. SOLUTION: This curable type resin composition contains a liquid of epoxy group-containing colloidal particles in an organic solvent prepared by reacting inorganic oxide colloidal particles dispersed in the organic solvent with an epoxy group-containing silane compound in the presence of an onium compound catalyst without substantially reactive with the epoxy groups and/or the epoxy group-containing colloidal particles and is capable of curing by heat or at room temperature.