| 摘要 |
PURPOSE: A lead frame for QFP type LOC package having elastic complementary unit attached is provided to obtain good bond ability and greatly reduce failure rate because the internal leads which a semiconductor chip is or isn't mounted to have same pa RAMeters. CONSTITUTION: A lead frame for PFP type LOC package having elastic complementary unit attached comprises bidirectional tapes(16) and an elastic compensating unit. The bidirectional tapes(16) are attached to 2-way internal leads(11,12,13,14) which a semiconductor chip is mounted to. The elastic complementary unit is attached to 2-way internal leads which a semiconductor chip isn't mounted to. Further, The elastic compensating unit is a soft thermal tape(17). |
