| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a grinding device of compact design, capable of providing wafers which are excellent in surface flatness. SOLUTION: Lower surface plates are provided as circles arranged at equal intervals on a concentric circle around an O-point, and loading-unloading stages 18 for wafers or loading stages an unloading stages for wafers, and the n-th order grinding stages are provided on the lower surface plates. Shafts which can rotate horizontally around the O-point are provided in the vertical direction of a base 19, and index heads are provided at the tops of the shafts. In this case, wafer chuck mechanisms, the number of which is equal to the number of stages namely (n+1 or n+2, or a multiple of those), and which are supported on the rotatable shafts, are provided on the undersurface of the index heads. Upper surface plates are provided on a concentric circle and at equal intervals on concentric circles having the same radiuses as those of the concentric circles of the lower surface plates, and on the underside of the index heads and the side surfaces of the shafts supporting the index head undersurfaces, partition walls the number of which equal to n+1 or n+2, for separating adjacent grinding stages during grinding the wafers, are provided so that they are hung down.</p> |
