| 摘要 |
PROBLEM TO BE SOLVED: To make the distribution of radicals of gaseous raw material uniform on a substrate, to make the film thickness on the substrate uniform and to eliminate trouble, such as unnecessary heat transfer to a reduction/expansion nozzle which can occur in the structure of the nozzle and film formation in the nozzle, by surely ejecting supersonic flow from the nozzle. SOLUTION: The gaseous raw material 7 and carrier gas 8 which are formed as plasma and are excited from the blowout port 10a of the plug nozzle 10 is ejected toward a plug slope 2a and are expanded along the conical slope of the plug 1. The streams of the gases 7, 8 intersect with each other at one point at the front end of the plug 2 and thereafter, the gases are introduced in the form of the supersonic plasma flow 11 uniform in the distribution of pressure into the substrate 5 arranged downstream of the plug nozzle 10. This flow collides against the substrate 5 and a film 6 is deposited thereon. |
