METALLIC MATERIAL WITH ENHANCED ADHESIVE POWER, LEAD FRAME FOR HIGHLY HEAT-RADIATING PACKAGE, AND HIGHLY HEAT-RADIATING SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To obtain a metallic material which can prevent peeling or cracks from occurring at bonded parts by subjecting the surface of an adhesive layer formed on the surface of a metallic material to a plasma treatment to generate a good adhesion state between the adhesive layer and a sealing resin. SOLUTION: After a metal 6 is stuck to the top of an inner lead 9 of a copper alloy lead frame with an adhesive layer 5 and the surface of the adhesive layer 5 is subjected to a plasma treatment in an O2 or CF2 atmosphere to form a heat-radiating member 6', an Si semiconductor chip 10 is fixed on the adhesive layer 5 of the heat-radiating member 6' with a silver paste. An inner lead 9 is connected to the electrode of the semiconductor chip 10 with a bonding wire 11. Then, an epoxy resin 12 for sealing is molded so as to cover the surroundings of the inner lead 9, the semiconductor chip 10, and the bonding wire 11, and an outer lead 13 is cut and formed to obtain a semiconductor package.