| 摘要 |
PROBLEM TO BE SOLVED: To provide economical semiconductor device in which heat dissipation characteristics are enhanced, while making the mounting floor area small. SOLUTION: A semiconductor basic body 1 has one side bonded to the bottom face of a metal case 2 and the other side arranged with an external terminal 3 which is led out from the opening of a metal case filled with insulating resin 4. One side part of the metal case 2 is bent substantially in parallel with the opening side, and the bend 2a serves as a terminal for external connection. |
