| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-supplying apparatus and a the chip-supplying method, which can perform the correcting actions of theθdirection and the X-Y direction after the detecting of the position at the same time, and can shorten the tact time. SOLUTION: In this chip-supplying apparatus, which recognizes the image of the chip attached to a wafer sheet, aligns the position of the chip at the pickup position of a mounting head based on the result of the detection, and supplies the chip, ring driving for moving the chip mounted on a wafer ring 13 is performed, by moving hinge points 23A, 23B and 23C privided at three- equally divided points at the outer surface of the wafer ring 23 in the horizontal direction via links 27A, 27B and 27C. Thus, in the correcting operations after the position detection of the chip 5, the position corrections of the X-Y directions and in rotating direction ofθcan be performed at the same time. The tact time of the position correcting operation can be shortened.
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