| 摘要 |
PROBLEM TO BE SOLVED: To reduce inductance of contact pins and accurately check up on electrical characteristics of ICs and LSIs, by avoiding a conductor being electrically connected to any lead pins of an IC package but enabling it to be electrically connected to arbitrary contact pins on an IC socket by the use of electrical components, etc. SOLUTION: Contact pins 2a electrically connected to power supply pins 3a of an IC 3 are connected to a conductor 5 by means of bypass capacitors 6, and contact pins 2b electrically connected to ground pins 3b of the IC 3 are connected to the conductor 5 by means of jumper resistances 7. This causes the conductor 5 and the contact pins 2b to be connected to a print pattern acting as the ground of a test board 4, and the contact pins 2a to a print pattern acting as a power supply for the test board 4. The bypass capacitors 7 and the jumper resistances 7 are formed into chip components, and their size is reduced not to interfere with the IC 3 to be measured.
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