| 摘要 |
An integrated circuit (IC) fabricated on a semiconductor chip (51) is electrically connected through an array (50) of pads to leads (54) of a package; the pad array includes alternate long pads (50a) and short pads (50b) exposed by first openings (51e/51f) and second openings (51d), respectively, the openings having wide portions and narrow portions, and the wide portions of the first openings are offset from the wide portions of the adjacent second openings so that the manufacturer arranges the long pads and the short pads at a fine pitch less than 40 microns. |
