| 摘要 |
Disclosed is a laser surveying apparatus including a body, a platform pivotally supported by the body about a first axis, a drive pivotally supported by the platform about a second axis transverse to the first axis, a head rotatably supported by the drive to rotate about a third axis transverse to the second axis, and a semiconductor laser supported by the head to project laser radiation transverse the third axis. Electrical power to the laser is supplied via rotatable connections thereby allowing the weight of a power source to be omitted from the rotating head. Selective adjustments of the head allow the laser to rotate in a horizontal plane, a vertical plane or an inclined plane. Selective adjustment of the platform permits the laser to irradiate in a vertical plane at differing horizontal angles so facilitating marking out of buildings, fences etc. In one form the laser may be used as a plumb line and shine through the platform and body down upon a style thereby facilitating accurate location of the apparatus. The laser and drive in one form are remotely controlled to effect rotation, on/off of the laser, and dither action of the laser.
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