CONDUCTIVE WIRE FOR PACKAGING OF THE LCD MODULE AND METHOD FOR MANUFACTURING THE SAME,申请号KR19980008861-传众专利搜索

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发明名称	CONDUCTIVE WIRE FOR PACKAGING OF THE LCD MODULE AND METHOD FOR MANUFACTURING THE SAME
摘要
申请公布号	KR100246842(B1)	申请公布日期	2000.03.15
申请号	KR19980008861	申请日期	1998.03.16
申请人	SAMSUNG SDI CO., LTD.	发明人	KIM, HONG KYEONG
分类号	G02F1/133;G02F1/1343;(IPC1-7):G02F1/133;G02F1/134	主分类号	G02F1/133
代理机构		代理人
主权项
地址

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