发明名称 LAYERED DIELECTRIC ON SILICON CARBIDE SEMICONDUCTOR STRUCTURES
摘要 <p>A dielectric structure is disclosed for silicon carbide-based semiconductor devices. In gated devices, the structure includes a layer of silicon carbide , a layer of silicon dioxide on the silicon carbide layer, a layer of another insulating material on the silicon dioxide layer, with the insulating materi al having a dielectric constant higher than the dielectric constant of silicon dioxide, and a gate contact to the insulating material. In other devices the dielectric structure forms an enhanced passivation layer or field insulator.</p>
申请公布号 CA2340653(A1) 申请公布日期 2000.03.09
申请号 CA19992340653 申请日期 1999.08.27
申请人 CREE, INC. 发明人 PALMOUR, JOHN WILLIAMS;LIPKIN, LORI A.
分类号 H01L29/749;H01L21/02;H01L21/04;H01L21/28;H01L21/314;H01L21/329;H01L21/336;H01L21/338;H01L21/822;H01L27/04;H01L29/06;H01L29/12;H01L29/161;H01L29/24;H01L29/40;H01L29/51;H01L29/739;H01L29/78;H01L29/812;H01L29/861;H01L29/94;(IPC1-7):H01L29/51 主分类号 H01L29/749
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