| 摘要 |
PROBLEM TO BE SOLVED: To efficiently adjusting the temp. (heating or cooling) of a wafer and reduce the time taken for cooling the wafer subjected to e.g. the baking treatment before developing. SOLUTION: A main temp. adjusting (cooling) board to be a mount 21, cooler 3 for keeping the mount 21 at e.g. 23 deg.C hold pins 22 for holding a wafer W slightly floating above the mount 21, lift mechanism 23 for pins, subsidiary cooling board 4 to be a subsidiary temp. adjusting board for cooling the wafer W from the back side of the mount 21, and lift means 5 for moving the subsidiary cooling board 4 up and down toward or away from the wafer W are provided. The subsidiary cooling board 4 is held at a lower temp. than that of the main cooling board. Using the main cooling board and subsidiary cooling board 4, the wafer W cooling begins, the subsidiary cooling board 4 is moved away from the wafer W at a higher temp. e.g. 30 deg.C than 23 deg.C, and then the wafer W is cooled by the main cooling board only.
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