| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a resin-sealed semiconductor device can be manufactured with a high yield. SOLUTION: A method for manufacturing semiconductor device includes a process for putting a second mold 721 on a first mold 722 in such a way that the mold 721 covers the gate 76 of the mold 722, a lead frame 12 the second mold 721 in such a way that the frame 12 covers an opening 80 of the mold 721, and a third mold 61 on the second mold 721, a process for filling up the molds 722, 721, and 61 with a resin, a process for removing a resin body formed by uniting the lead frame 12 with a molded resin composed of a package section and a gate section from the thrice laminated molds, a process for removing the resin body includes a step of separating the resin body and second mold 721 from the first mold 722 and a process of cutting the resin body along the junction 4 between the gate section and package section by using a gate cutting jig.
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