发明名称 EPOXY RESIN COMPOSITION FOR PHOTO-SEMICONDUCTOR AND PHOTO-SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which can give a molding having excellent mold release, non-cloudiness, and high transparency by using an epoxy resin, a curing agent, a cure accelerator, and a mold release agent having a specified structure as the essential components. SOLUTION: The epoxy resin used is not particularly limited so far as it is one having at least two epoxy groups in the molecule and is exemplified by a bisphenol A type epoxy resin or an alicyclic epoxy resin. The curing agent used is exemplified by hexahydrophthalic anhydride or an amine type curing agent, and the cure accelerator used is exemplified by triphenylphosphine or triethanolamine. The mold release agent used is a compound represented by the formula (wherein R is a 12-100C saturated hydrocarbon group; and (x) is an integer of 6-100), for example, CH3(CH2)46CO(OCH2CH2)16OH and is used in an amount of, desirably, 0.1-5 wt.% based on the total amount of all the components. The mold release agent permits the composition to give a molding satisfactory in all of mold release, apparent transparency, and light transmittance.
申请公布号 JP2000063635(A) 申请公布日期 2000.02.29
申请号 JP19980239262 申请日期 1998.08.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 YAMANAKA HIROSHI;NAKASUJI IKUO;MIYATA YASUTAKA;MAKITA TOSHIYUKI
分类号 C08L63/00;C08L71/02;H01L21/027;(IPC1-7):C08L63/00 主分类号 C08L63/00
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