发明名称 |
METHOD OF DRYING COPPER FOIL AND COPPER FOIL DRYING APPARATUS |
摘要 |
PURPOSE: The method dries a copper foil(1) after surface treatment with low power consumption and controls the surface heating of the copper foil to maintain the drying temperature above 100°C to form an eutectic alloying of a passivation metal and the copper foil. CONSTITUTION: The method dries the copper foil by irradiating a near infrared ray at least on one side of the copper foil after the surface treatment. The surface treatment includes a nodularization and a passivation. The copper foil is an electrodeposited copper foil. The method improves the acid resistance and a delamination strength by increasing the adhesion force to a resin substrate and prevents the copper foil from being separated from the resin substrate. The nodularization is performed by depositing a particle on the surface of the copper foil and a near infrared ray is irradiated to the surface of the copper foil.
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申请公布号 |
KR20000011746(A) |
申请公布日期 |
2000.02.25 |
申请号 |
KR19990028680 |
申请日期 |
1999.07.15 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
IMADANOBUYUKI;OSIMAGAZHIDE |
分类号 |
H05K3/24;F26B3/28;F26B13/10;H05K3/22;H05K3/38;(IPC1-7):H05K3/24 |
主分类号 |
H05K3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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