发明名称 FORMATION OF ELECTRODE FOR COMPOUND SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a method suitable for forming the electrode of a compound semiconductor using lift-off method. SOLUTION: The method for forming an electrode comprises a step for forming an inorganic insulating film 3 on the major surface 2 of a compound semiconductor 1, a step for making an opening 4 for forming an electrode in the insulating film 3, a step for making a recess 5 of specified depth at a part corresponding to the opening 4 in the major surface 2 of a compound semiconductor 1, a step for forming an electrode material 6 of specified thickness above the recess 5 and the insulating film 3, a step for removing the insulating film 3 by etching, and a step for removing the electrode material 6 remaining on the insulating film 3.
申请公布号 JP2000058481(A) 申请公布日期 2000.02.25
申请号 JP19980222021 申请日期 1998.08.05
申请人 SANYO ELECTRIC CO LTD;TOTTORI SANYO ELECTRIC CO LTD 发明人 YAMAMOTO SHIGERU
分类号 H01L21/28;H01L33/36;H01L33/44 主分类号 H01L21/28
代理机构 代理人
主权项
地址