| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer housing device that is capable of housing wafers of different diameters by a method, wherein the shelves of the wafer housing device where the wafers are housed are varied in shape. SOLUTION: Side boards 4 and housing shelves 5 of a wafer housing device are so provided sloped. The side boards 4 are provided confronting each other at a distant from each other, that becomes shorter toward the opening of the wafer housing device. The housing shelves 5 are provided to slope upward from their fixing ends to centers. With this setup, wafers 6 and 8 of different diameters can be housed in the wafer housing device. The cross sections of the housing shelves 5 are curved surfaces, whereby the housing shelves cause less damages to wafers, when they come into contact with wafers to house.</p> |
