发明名称 SOLID PICKUP DEVICE AND FABRICATING METHOD OF THE SAME
摘要 PURPOSE: A solid pickup device is provided to improve defect characteristics and sensitivity of a charge coupled device by differentiating deposition thickness of an insulating layer from final thickness of the insulating layer after nitrogen annealing. CONSTITUTION: The device comprises a plurality of photoelectric conversion regions formed in a second conductive well region formed on a first conductive substrate; a plurality of charge coupled devices formed between the photoelectric conversion regions; a channel stop layer formed around the photoelectric regions; a plurality of first and second gates, insulated by a gate insulating layer and a first and a second insulating layers on the charge coupled device channel regions, overlapping each other to be continuously formed; a metal shading layer formed on the second insulating layer excluding the photoelectric conversion region; an oxide layer, as an interlayer insulating film, formed on an overall surface including the metal shading layer; an insulating layer for planarization formed on the oxide layer; a color filter layer formed on the insulating layer for planarization corresponding to the photoelectric conversion region; and a micro lens formed on the insulating layer for planarization to correspond to the color filter layer and the photoelectric conversion region.
申请公布号 KR20000008283(A) 申请公布日期 2000.02.07
申请号 KR19980028021 申请日期 1998.07.11
申请人 HYUNDAI MICRO ELECTRONICS CO.,LTD 发明人 HONG, DAE UK
分类号 H01L27/146;(IPC1-7):H01L27/146 主分类号 H01L27/146
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