SEMICONDUCTOR PACKAGE HAVING CHIP-ON-CHIP STRUCTURE AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A semiconductor package having a chip-on-chip structure is provided to maintain a constant thickness after a chip-to-chip adhesive process by forming an insulating adhesive film. CONSTITUTION: The package comprises a semiconductor substrate having an external contact terminal; a first semiconductor chip, adhered to one surface of the substrate, in which a plurality of electrode pads are formed; a second semiconductor chip to be adhered to a top of the first semiconductor chip; a jelly-typed insulating adhesive adhering a lower surface of the second semiconductor chip to an upper surface of the first semiconductor chip; an electric connector electrically connecting the first and the second semiconductor chips to an external contact chip terminal of the substrate; and a package body in which the first and the second semiconductor chips and the electric connector are formed.