METHOD FOR CUTTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method which is efficient for a wafer and which is environmental by cutting a substrate along a first pattern with a straight blade while an oblique blade is detached from the substrate after the cut groove of the first pattern is made. SOLUTION: A first blade 11 is in a separate position detached from a wafer 42 and a second blade 12 is in a cut position. The wafer 42 is cut along a scribbled pattern with the first blade 11 in a first bus. The wafer 42 moves to the second blade 12 at comparatively low speed in a wafer cut feed operation. Deionized (DI) water cools the second blade 12 in a cut process and it is supplied for cleaning the wafer 42. DI water functions as lubricant between the second blade 12 and the wafer 42, and the chipping of the wafer 42 is prevented. For saving water, the supply of DI water to the first blade 11 is interrupted in a second bus.