| 摘要 |
PROBLEM TO BE SOLVED: To form short routes from the heat generating surface of a semiconductor element to the thermal via of a wiring board through bump electrodes by connecting the bump electrodes of the semiconductor element to the thermal via after alignment. SOLUTION: A semiconductor element 101 is electrically connected to wiring 103 on a wiring board 105 through a plurality of bump electrodes 102 and, in addition, parts of the electrodes 102 are also connected thermally. Since the wiring 103 rises in the portion of the wiring board 105 where a thermal via 104 exists, the bump electrode 102 on the via 104 is deformed. Since the electrode 102 on the via 104 is deformed, in addition, the thermal route further becomes shorter and a good characteristic can be obtained. Therefore, the route from the heat generating section of the element 101 to the thermal via 104 becomes very short and, since the material used for the electrodes 102 is usually a metal, a high coefficient of thermal conductivity can also be expected. |
