发明名称 THERMOSETTING ELECTROCONDUCTIVE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain a thermosetting electroconductive adhesive improved in storage stability, which adhesive contains a product prepared by subjecting to a specified pretreatment a curing agent prepared by pretreating with an isocyanate the reaction product of an imidazole derivative with an epoxy compound. SOLUTION: There is provided a thermosetting electroconductive adhesive comprising a curing agent prepared by pretreating with an isocyanate the reaction product of an imidazole derivative with an epoxy compound, an epoxy composition curable with the curing agent, and an electroconductive material, wherein the curing agent is further treated with an isocyanate compound and a polyol compound in an epoxy resin which does not dissolve or swell the curing agent. In an embodiment, the pretreatment with the isocyanate compound and the polyol compound is carried out by using 100 pts.wt. curing agent, 0.01-20 pts.wt. isocyanate compound, and 0.01-20 pts.wt. polyol compound.
申请公布号 JP2000026829(A) 申请公布日期 2000.01.25
申请号 JP19980193821 申请日期 1998.07.09
申请人 THREE BOND CO LTD 发明人 OSADA MASAYUKI;TOMIOKA HIDEKAZU
分类号 C08G59/40;C09J9/02;C09J163/00;C09J175/00;(IPC1-7):C09J163/00 主分类号 C08G59/40
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