发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide a composition excellent in a residual film ratio, resist profile, and the like to deep ultraviolet rays by containing a polymer with specific partial structure. SOLUTION: This positive photosensitive resin composition contains a compound producing acid by active light, a polymer with partial structure expressed by a formula, a nitrogen contained basic compound, and a fluorinated and/or silicone surfactant. In the formula, R1-R4 independently represent hydrogen atom. hydroxyl group, carboxyl group or alkyl group. R1 and R3, or R2 and R4 can be bonded to each other to form a ring. X represents a bivalent organic residual group of 2-20 in the number of carbon, R5 represents hydrogen atom, alkyl group, substitutional alkyl group or a group expressed by -COOR5 and composing a group decomposed under the action of acid. Z represents an atom group forming a cyclohexane ring or a decalin ring together with a carbon atom. Y is expressed by a formula II, where R6, R7 independently represent hydrogen atom or methyl group, and n represents 1 or 2.</p>
申请公布号 JP2000019734(A) 申请公布日期 2000.01.21
申请号 JP19980186271 申请日期 1998.07.01
申请人 FUJI PHOTO FILM CO LTD 发明人 KAWABE YASUMASA;SATO KENICHIRO;AOSO TOSHIAKI
分类号 G03F7/004;G03F7/039;H01L21/027 主分类号 G03F7/004
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