| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing technique of a semiconductor device that handles merely the work start result of a product and product characteristics, and can specify a process and a device for affecting the product characteristics merely with a small amount of information even when there is no in-process inspection result. SOLUTION: A manufacturing device is placed in a semiconductor manufacture line, and is composed of a wafer manufacture process, a product characteristic inspection process, a failure process device specification system 3, or the like. In this case, the failure process device specification system 3 is composed of a data reception part 4 that collects the work start result of a daily product and product characteristics from the wafer manufacture process and the product characteristic inspection process, respectively; a work start result accumulation part 5 that stores a work start result; a product characteristic accumulation part 6 for accumulating a product characteristic inspection result; a calculation processing part 7 that uses the work start result and the product characteristics, determines the degree of influence where a device for each process affects the product characteristics using the work start result and product characteristics, and specifies the process and device for affecting the product characteristics based on the value; and an output part 8 that outputs the processing result.
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