| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent the occurrence of a short circuit between electrodes when the electrodes are mounted on a substrate by soldering by coating ohmic electrodes between a pair of soldering electrodes with an insulating film. SOLUTION: After the whole surface of an elemental positive temperature coefficient thermistor element 1 is coated with an insulating film 6 so as to cover ohmic electrodes 2 and 3, metallic material layers 7 and 8 are formed on the insulating film 6 at both end sections of the element 1. Then mixtures are obtained by dispersing the metallic materials in the layers 7 and 8 in the underlying insulating film 6 by simultaneously baking the layers 7 and 8 with the insulating film by baking the formed chip and soldering electrodes 4 and 5 are formed at both end sections of the element 1. At the time of forming the electrodes 4 and 5, the electrodes 4 and 5 are respectively electrically connected to the ohmic electrodes 2 and 3. Therefore, the resistance can be reduced and, at the same time, the occurrence of a short circuit between the electrodes 2 and 3 can be prevented effectively when the electrodes 2 and 3 are mounted on a substrate by soldering.
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