MANUFACTURE OF MULTILAYERED PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayered printed wiring board provided with via holes which is excellent in mass-productivity and connection reliability and can be made thin and which is superior in electrical characteristic and rigidity and has an excellent surface mounting property. SOLUTION: In the method for manufacturing a multilayered printed wiring board provided with via holes on its surface layer, a varnish made mainly of macromolecular weight polymer having a film formation ability is mixed with an inorganic filler, and then the mixture is applied onto the roughened surface of copper foil and a solvent is removed therefrom by drying. The obtained copper-plated adhered film is used as an insulation layer for supporting the via holes in the surface layer.