发明名称 AQUEOUS ELECTROCONDUCTIVE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an aqueous electroconductive adhesive composition consisting of an aqueous electroconductive adhesive to be used for electro circuit production, easily prepared, needing no specific device or limitation in handling and for working environment, and having adhesivity and electroconductivity sufficient on practical purposes. SOLUTION: The objective composition is composed of a water-soluble resin and/or a water-dispersible resin as a base material for the adhesive, one kind or 2-3 kinds of electroconductive fine granules selected from electroconductive fine granules, metal-plated electroconductive fine granules and electroconductive fine granules treated with a hydrophobic substance, and water or a mixed solvent mainly composed of water, and optionally a substance selected from a dispersion stabilizer, an adhesion adjuvant and a plasticizer.
申请公布号 JP2000008011(A) 申请公布日期 2000.01.11
申请号 JP19980210246 申请日期 1998.06.19
申请人 NEEDS:KK 发明人 NANBA TOSHINORI;WATANABE KAZUO;KUROGAKI YUKIO
分类号 C09J9/02;(IPC1-7):C09J9/02 主分类号 C09J9/02
代理机构 代理人
主权项
地址