| 摘要 |
PROBLEM TO BE SOLVED: To facilitate removal of electronic parts soldered on a substrate by bending a tip part of an iron part for melting a solder while abutting the solder and forming it in a wedge shape. SOLUTION: A tip part 32 of an iron part 31 is bent by a bending part 33, and formed in a wedge shape with two planes having the same start point. The iron part 31 of the heated solder iron is abutted to one lead wire 21 and a soldering part 13 of a pattern 11 part so as to melt a solder. At the point when the solder is melted, a wedge-shaped portion of the tip part 32 of the iron part 31 is inserted into the bottom of the bent lead wire 21, and the solder iron is rotated in an arrow direction while the tip part 32 of the iron part 31 is pushed in a bend start position direction of the lead wire 21 so as to straighten the bending of the lead wire. In this case of the other wire 21, bending is straightened in the same way. Then, after the solder in a through hole is sucked by a solder suction unit while melting, a condenser 20 is removed.
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