发明名称 CATHODE DEVICE IN AUTOMATIC PLATING
摘要 PROBLEM TO BE SOLVED: To homogeneously form plating layers by erecting a planar object to be plated and continuously transferring this object in a plating bath. SOLUTION: The apparatus for plating the planar object 3 to be plated which is placed perpendicularly on a rail 2 disposed in the plating bath while transferring the object is provided with power feed rollers 7 for passing current to the planar object 3 to be plated by bringing the rollers into contact with the object at cathode bars 6 vertically installed along a rail 2. The apparatus is provided with pressing means (pressing bodies 10 and springs 11) for pressing the feed rollers 7 to the planar object 3 to be plated.
申请公布号 JP2000001797(A) 申请公布日期 2000.01.07
申请号 JP19980168415 申请日期 1998.06.16
申请人 SAKAE DENSHI KOGYO KK;OBA KAZUO 发明人 OBA KAZUO
分类号 C25D17/06;C25D17/10;(IPC1-7):C25D17/10 主分类号 C25D17/06
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