发明名称 |
CATHODE DEVICE IN AUTOMATIC PLATING |
摘要 |
PROBLEM TO BE SOLVED: To homogeneously form plating layers by erecting a planar object to be plated and continuously transferring this object in a plating bath. SOLUTION: The apparatus for plating the planar object 3 to be plated which is placed perpendicularly on a rail 2 disposed in the plating bath while transferring the object is provided with power feed rollers 7 for passing current to the planar object 3 to be plated by bringing the rollers into contact with the object at cathode bars 6 vertically installed along a rail 2. The apparatus is provided with pressing means (pressing bodies 10 and springs 11) for pressing the feed rollers 7 to the planar object 3 to be plated.
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申请公布号 |
JP2000001797(A) |
申请公布日期 |
2000.01.07 |
申请号 |
JP19980168415 |
申请日期 |
1998.06.16 |
申请人 |
SAKAE DENSHI KOGYO KK;OBA KAZUO |
发明人 |
OBA KAZUO |
分类号 |
C25D17/06;C25D17/10;(IPC1-7):C25D17/10 |
主分类号 |
C25D17/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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