发明名称 METHOD FOR DEPOSITING THIN FILM AND THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a laminated thin film capable of precisely controlling the film thickness or the compsn. SOLUTION: A uniform compd. target 21 composed of >= two materials is used, the magnetic field is periodically changed, and the depositing rate of one material is periodically increased to that of the other material. The change of the magnetic field changes the magnetic field sweep time and changes the thickness of the deposition layer. In this case, the layer thickness is inversely proportioned to the magnetic field sweep time. Or, the magnetic intensity is changed to change the relative compsn. of sputter seed. In an electromagnet, it is executed by controlling the amplitude of the waveform of the input current, i.e., the maximum current.
申请公布号 JP2000001778(A) 申请公布日期 2000.01.07
申请号 JP19990106548 申请日期 1999.04.14
申请人 INTERNATL BUSINESS MACH CORP <IBM>;TOSHIBA CORP 发明人 BILARGE SADESAI;KATADA TOMIO;PARKS CHRISTOPHER;JOHN BENEDICT
分类号 C23C14/35;H01L21/285;(IPC1-7):C23C14/35 主分类号 C23C14/35
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