| 摘要 |
A method of providing such an intercoupling component (10) includes positioning terminals (34) within holes (64) of an insulative support member (62) and attaching a solder ball (42) to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contact a corresponding solder ball soldering the solder ball to the end of the terminal while maintaining the generally spherical of the solder ball.
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