Adapter which emulates ball grid array packages

摘要

An adapter for emulating a ball grid array type package includes a dielectric substrate having an array of holes formed therein. A layer of conductive material is deposited on a bottom surface of the substrate and onto the inner walls of the holes. The bottom surface of the substrate is then selectively etched to form separate conductive traces extending from each of said holes and terminating in a pad proximate to each hole. A conductive pin is inserted into each of the holes and soldered in place. The pads are then provided with a small ball of solder, using well known techniques, so that the bottom surface of the substrate now appears virtually identical to a bottom surface of a conventional ball grid array type package. The adapter is then mounted to an array of contact pads on a printed circuit board by fusing the solder balls to corresponding contact pads on the board. The pins are now electrically connected to the contact pads on the circuit board and may be connected to a tester.