| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding solids using covalent bond in relatively low temperature by bringing organosilicon compound unimolecular layers applied on the surface of two solids into contact with each other. SOLUTION: This method comprises applying unimolecular layers of an organosilicon compound of the formula (R is methyl, ethyl or propyl; X is 1, 2, 3 or 4; Y is 2-6) [preferably bis(alkoxysilylpropyl)disulfane] on the respective surfaces of two solids and, thereafter, bringing the solids into contact with each other so as to bond their almost smooth surface of the solids. The solids to be bonded preferably have hydrophilic surfaces. The compound of the formula is preferably used in gas phase and deposited on the surfaces so as to form the unimolecular layers. The compound of the formula is preferably used as a solution having >0-10<-3> mol/L concentration. This method can be used for a composite structural material for microelectronics and micromechanics. |
