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发明名称
GOLD ALLOY FOR BONDING WIRE OF SEMICONDUCTOR DEVICE
摘要
申请公布号
KR100231933(B1)
申请公布日期
1999.12.01
申请号
KR19960077607
申请日期
1996.12.30
申请人
KANG, DO-WON
发明人
KANG, DO-WON
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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