发明名称 WIRE-BONDING METHOD AND DEVICE, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To enable enduring a harsh thermal cycling and a harsh power cycle by a method, wherein the junction part of a wire is delivered to the feeding side of the wire, the junction part is positioned with respect to the surface to be junctioned, and the positional junction part is connected to the surface to be junctioned by applying pressure and vibration is use of an ultrasonic wire bonder. SOLUTION: A bonding tool 111, with which a wire 101 of about 100 to 600 μm in diameter, is pressed to the surface to be junctioned, is attached to a horn 110 provided with a wire pressing part 112. A preform structure 140 is arranged on the inserting path of a wire positioned on the feeding side of the wire of the bonding tool 111, and a sectional shape is formed on the wire 101 which is let out through a through hole 115 provided on the horn 110 from a feeding reel. The junction part of the wire 101 is positioned on the surface to be junctioned by letting out the junction part of the wire 101, and the positioned junction part is connected to the surface to be junctioned by applying pressure and vibration by using an ultrasonic wire bonder.
申请公布号 JPH11330134(A) 申请公布日期 1999.11.30
申请号 JP19980128586 申请日期 1998.05.12
申请人 HITACHI LTD 发明人 YAMAMOTO NORIAKI;TANEDA KOKI;YAMAMURA HIROHISA;YASUKAWA AKIO;SUZUKI ATSUSHI;SHIGEMURA TATSUYA
分类号 H01L25/07;H01L21/00;H01L21/60;H01L21/607;H01L25/18;H05K13/06 主分类号 H01L25/07
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