发明名称 INSULATION COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an insulation composition having excellent electrical insulation properties and thermal conductivity, whose composition contains a liquid crystal resin prepared by polymerizing a resin composition containing a monomer having a mesogenic group and has specified or higher thermal conductivities in two rectangular directions. SOLUTION: There is provided an insulation composition containing a liquid crystal resin obtained by thermally reacting a resin composition containing a monomer having a carboxyl-free mesogenic group represented by formula I under a specified voltage applied in the direction of thickness and being in a solid state in which the monomer molecules are partially arranged about the mesogenic groups as centers and having thermal conductivities of 0.4 W/mK in two rectangular directions. If required, this composition contains an inorganic ceramics, such as aluminum oxide, boron nitride, or silicon carbide, having a thermal conductivity of 10 W/mK or above. The resin used is an epoxy resin, a polyurethane resin, an acrylic resin, or the like. In formula I, X is a single bond, -N=N-, -C≡C-, or a bond represented by formula II; n is 0-4; and Y is -R, -OR (wherein R is a 1-8C aliphatic hydrocarbon group), -F, -Cl, -Br, -CN, or the like.
申请公布号 JPH11323162(A) 申请公布日期 1999.11.26
申请号 JP19990069543 申请日期 1999.03.16
申请人 HITACHI LTD 发明人 AKATSUKA MASAKI;TAKEZAWA YOSHITAKA;ITO YUZO
分类号 H01B3/40;C08K3/00;C08L63/00;C08L101/12;(IPC1-7):C08L101/12 主分类号 H01B3/40
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