SURFACE POLISHER OF WAFER AND POLISHING METHOD OF WAFER USING IT

摘要

PROBLEM TO BE SOLVED: To produce a semiconductor wafer with a flat surface whose flatness measured by an electrostatic capacity type thickness meter is 0.5 μm or less. SOLUTION: This surface polisher is provided with the upper chuck mechanism A of a wafer which has a head 3 installed on a turnable hollow rotary shaft 2 and a rigid suction pad 4 which can directly suck the wafer installed in the head, a polishing cloth 12 placed on the work table 11 provided on the rotary shaft 10, the rigid absorption pad 4 surface of the upper chuck mechanism A and a liquid supply nozzle B which can blow a liquid from the side surface or lower surface of the upper chuck mechanism A to the absorption surface of the wafer 5 of this suction pad.