| 摘要 |
PROBLEM TO BE SOLVED: To reduce variations of pressurizing of bump electrodes, and improve reliability of flip chip connection by forming a protrusion having a form almost corresponding to arrangement of a plurality of bump electrodes, on the bottom surface of a tool, and using it in such a manner that the protrusion is positioned on the back of a semiconductor chip almost corresponding to the arrangement of bump electrodes. SOLUTION: A protruding part 3 having a form almost corresponding to surrounding arrangement of a plurality of bump electrodes 7 formed on the surface of a chip 5 is formed on the bottom surface of a tool 1 for chucking a chip. The tool 1 is so used that the protruding part 3 is positioned on the back of the chip 5 almost corresponding to the bump electrodes 7. The area of a chip chucking surface is determined by the protrusion 3 and reduced., As a result, when undulation is generated on the bottom surface of the tool, its influence can be almost ignored. Provability that unnecessary foreign matter such as dust exists between the protrusion 3 and the chip 5 is decreased. As a result, an effective pressuring force can be applied only to the bump electrodes, and variations of pressurizing can be reduced. |
